Precision electronic and optical assembly

High-density SMT fabrication

Automated pick-and-place lines running dual-gantry heads handle rigid, flex, and rigid-flex substrates with component placement down to 15-micron mechanical repeatability across high-volume and prototype runs.

Optical alignment and bonding

Class 1000 laminar benches calibrated for beam collimation, multi-wavelength sensor mounting, and active laser diode alignment using UV-cured optical adhesives with zero thermal shift.

Specialized smart cards

Hot-lamination and direct chip encapsulation for dual-interface micro-modules, high-frequency RFID coils, and tamper-resistant cryptographic cards engineered to international durability benchmarks.

Zero tolerance for invisible solder voids or angular drift

Every production lot undergoes automated optical inspection, 3D X-ray verification of ball-grid arrays, and environmental thermal cycling before batch sign-off.

Ready for engineering review?

Submit your Gerber files, bill of materials, or optical requirements for feasibility assessment.